This equipment can be used as a repair machine that cuts short of fine circuits in the manufacturing of FPD, such as TFT-LCD or PDP, or as a scribing machine that cuts chips in the RFID or semiconductor manufacturing process, or as a Via Hole Drilling machine in the MLCC manufacturing process. At present, the equipment is configured to be applicable to a variety of Micro Machining Applications such as cutting, drilling and ablation using DPSS Laser (IR-1064㎚, GR-532㎚, DUV-266㎚) and Fiber Laser (1070㎚).